Structure And Bonding

Journal Title：Structure And Bonding

Structure and Bonding is a publication which uniquely bridges the journal and book format. Organized into topical volumes, the series publishes in depth and critical reviews on all topics concerning structure and bonding. With over 50 years of history, the series has developed from covering theoretical methods for simple molecules to more complex systems.

Topics addressed in the series now include the design and engineering of molecular solids such as molecular machines, surfaces, two dimensional materials, metal clusters and supramolecular species based either on complementary hydrogen bonding networks or metal coordination centers in metal-organic framework materials (MOFs). Also of interest is the study of reaction coordinates of organometallic transformations and catalytic processes, and the electronic properties of metal ions involved in important biochemical enzymatic reactions.

《结构与键合》是一本独特地将期刊和书籍形式结合起来的出版物。该系列分为专题卷，发表有关结构和键合的所有主题的深入和批判性评论。该系列已有 50 多年的历史，从涵盖简单分子的理论方法发展到更复杂的系统。

该系列中讨论的主题现在包括分子固体的设计和工程，例如基于互补氢键网络或金属有机骨架材料 (MOF) 中的金属配位中心的分子机器、表面、二维材料、金属簇和超分子物种。同样令人感兴趣的是有机金属转化和催化过程的反应坐标研究，以及参与重要生化酶促反应的金属离子的电子特性。

Structure And Bonding创刊于1966年，由Springer Verlag出版商出版，收稿方向涵盖化学 - 无机化学与核化学全领域，此期刊水平偏中等偏靠后，在所属细分领域中专业影响力一般，过审相对较易，如果您文章质量佳，选择此期刊，发表机率较高。平均审稿速度 ，该期刊近期没有被列入国际期刊预警名单，广大学者值得一试。